Welcome to IEEE AIVR 2019
Research in Virtual Reality (VR) is concerned with computing technologies that allow humans to see, hear, talk, think, learn, and solve problems in virtual and augmented environments. Research in Artificial Intelligence (AI) addresses technologies that allow computing machines to mimic these same human abilities. Although these two fields evolved separately, they share an interest in human senses, skills, and knowledge production. Thus, bringing them together will enable us to create more natural and realistic virtual worlds and develop better, more effective applications. Ultimately, this will lead to a future in which humans and humans, humans and machines, and machines and machines are interacting naturally in virtual worlds, with use cases and benefits we are only just beginning to imagine.
The IEEE International Conference on Artificial Intelligence and Virtual Reality (AIVR 2019) is a unique event, addressing researchers and industries from all areas of AI as well as Virtual, Augmented, and Mixed Reality. It provides an international forum for the exchange between those fields, to present advances in the state of the art, identify emerging research topics, and together define the future of these exciting research domains. We invite researchers from Virtual, as well as Augmented Reality (AR) and Mixed Reality (MR) to participate and submit their work to the program. Likewise, any work on AI that has a relation to any of these fields or potential for the usage in any of them is welcome. Please refer to the different submission categories under "For Authors" above for further details.
After the very successful first IEEE AIVR 2018 in Taichung, Taiwan, we are happy to host the conference in the United States this year. IEEE AIVR 2019 will take place on the shore of the beautiful San Diego Bay. We are very much looking forward to your contributions and to welcoming you to sunny California in December 2019!
from industry (H. Benko from Facebook Reality Labs, V. Swaminathan from Adobe, P. Conoval from Northrop Grumman Coorp.) and
academia (J. Bailenson from Stanford, C. Dede from Harvard, T. Höllerer from UC Santa Barbara)